For the past weeks ago, we heard some news about Huawei Ascend P8 which is reavealed some specs. It said that the next flagship will follow traditionally for an impressively thin design with a metal chassic around. Addtionally, its phone will probably come with a 5.2″ 1080p display as well as runs on the HiSilicon Kirin 930 chipset. More detail, this chipset will be built on TSMC’s 16nm process and be packed an octa-core processor.

And fortunately, we now got some more news about this phone which is alleged metal chassis. The leaked images showed me a super thin frame after a careful check but we still search for its exact measurements.

Now, we can see a couple slots on the frame which presumably are for the trays that the frame will house. It isn’t clear yet if both are SIM trays or it’s a SIM + microSD combo, however. A ‘multipurpose’ tray can’t be ruled out either; quite a lot of phone makers have been opting for these lately, where you get to choose between a second SIM and a microSD card.

Now, you can look at the carved out holes, you can see a single-LED flash while this phone comes with a couple slots on the frame. It means that it maybe has two-sim cards or one sim card and a micro memory card. We’ve seen Huawei connect the SIM and memory slot into a single tray, so this might be the case with the Huawei Ascend P8 as well.

Huawei Ascend P8 is expected to be announced in January on CES in Las Vegas or  at the MWC expo in early March in Barcelona. We will keep our eyes on them to let you know more.

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